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BAS16H-QX - Nexperia

Description: Diodes - General Purpose, Power, Switching BAS16H-Q/SOD123F/SOD2

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PCB Footprints
BAS16H-QX - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD123F
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3D Models
BAS16H-QX - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD123F
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BAS16H-QX Details

  • Manufacturer Part Number:

    BAS16H-QX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD123F

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.215 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.83 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Reverse Test Voltage:

    80 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

BAS16H-QX Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAS16H-QX is a standard SOD323 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure reliable operation of BAS16H-QX in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using a thermal interface material, and minimizing thermal resistance between the device and the PCB.
  • Yes, BAS16H-QX can be used in switching applications, but it is essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range to avoid overheating and reduce electromagnetic interference (EMI).
  • To handle ESD protection when working with BAS16H-QX, it is recommended to follow proper ESD handling procedures, including using ESD-safe workstations, wearing ESD-protective clothing, and using ESD-protective packaging and storage materials.
  • The recommended storage condition for BAS16H-QX is in a dry, cool place with a temperature range of -40°C to 125°C and a relative humidity of 60% or less, in accordance with the JEDEC standard J-STD-033.

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BAS16H-QX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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