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BAS21E6327HTSA1 - Infineon

Description: Diodes - General Purpose, Power, Switching AF DIODE 250V 0.25A

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PCB Footprints
BAS21E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23
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3D Models
BAS21E6327HTSA1 - Infineon  - 3D model - SOT23 (3-Pin) - SOT-23
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BAS21E6327HTSA1 Details

  • Manufacturer Part Number:

    BAS21E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    TR, 7 INCH: 3000

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    250 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    250 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAS21E6327HTSA1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BAS21E6327HTSA1 is a 5-pin SOT-23 package with a minimum pad size of 1.3mm x 1.3mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good thermal conduction to a heat sink or PCB.
  • The maximum allowed power dissipation for the BAS21E6327HTSA1 is 1.4W at an ambient temperature of 25°C, and it decreases with increasing temperature.
  • To handle the ESD sensitivity of the BAS21E6327HTSA1, it is recommended to follow proper ESD handling procedures, use ESD-protective packaging, and ensure that the device is not exposed to electrostatic discharge during handling and assembly.
  • The recommended storage condition for the BAS21E6327HTSA1 is in a dry, cool place with a temperature range of -40°C to 125°C and a relative humidity of 60% or less.

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BAS21E6327HTSA1 Overview

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For a full list of alternate parts for BAS21E6327HTSA1, check out Findchips.com