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BAS40DW-05-TP - MCC

Description: Small Signal Schottky Diodes

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PCB Footprints
BAS40DW-05-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363
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3D Models
BAS40DW-05-TP - MCC  - 3D model - SOT23 (6-Pin) - SOT-363
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BAS40DW-05-TP Details

  • Manufacturer Part Number:

    BAS40DW-05-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, ULTRA SMALL, PLASTIC PACKAGE-6

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    2 BANKS, COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Recovery Time-Max:

    0.005 µs

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

BAS40DW-05-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAS40DW-05-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a 0.5mm diameter hole in the center for the drain pin.
  • To ensure reliable wire bonding, use a wire bondable gold wire with a diameter of 0.7mil to 1.0mil, and follow the recommended wire bonding parameters: 150°C to 180°C bonding temperature, 50gf to 100gf bonding force, and 10ms to 20ms bonding time.
  • The maximum allowable power dissipation for BAS40DW-05-TP is 1.5W at an ambient temperature of 25°C, with a maximum junction temperature of 150°C.
  • To handle ESD protection for BAS40DW-05-TP, use a human body model (HBM) ESD protection circuit with a minimum of 2kV rating, and follow proper handling and storage procedures to prevent ESD damage.
  • The recommended storage condition for BAS40DW-05-TP is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity of 60% or less, in its original packaging or a shielded bag to prevent ESD damage.

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BAS40DW-05-TP Overview

Use the download button to access the BAS40DW-05-TP schematic symbol, PCB footprint, and 3D model.
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