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BAS70H-QX - Nexperia

Description: plastic, surface-mounted package; 2 leads; 2.6 mm x 1.6mm x 1.1 mm body , 70V , 70mA , 1V @ 15mA , 2pF @ 0V, 1MHz

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PCB Footprints
BAS70H-QX - Nexperia PCB footprint - Other - Other - SOD123F_2025
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BAS70H-QX - Nexperia  - 3D model - Other - SOD123F_2025
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BAS70H-QX Details

  • Manufacturer Part Number:

    BAS70H-QX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD123F

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.1 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.07 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

BAS70H-QX Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the BAS70H-QX is a standard SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure reliable operation of the BAS70H-QX in high-temperature environments, it is recommended to follow proper thermal design and layout practices, such as providing adequate heat sinking, using thermal vias, and minimizing thermal resistance between the device and the PCB.
  • The maximum allowable voltage on the BAS70H-QX's input pins is 6 V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the input voltage below 5.5 V to ensure proper ESD protection and to prevent damage to the device.
  • While the BAS70H-QX can be used as a switch, it is not recommended as it is designed to be a voltage regulator and not a switch. Using it as a switch may lead to reduced reliability, increased power consumption, and decreased performance.
  • The power dissipation of the BAS70H-QX can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Additionally, the thermal resistance of the package and the PCB should be taken into account to ensure reliable operation.

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BAS70H-QX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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