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BAW101E6327HTSA1 - Infineon

Description: Diode Array 2 Independent 300 V 250mA (DC) Surface Mount TO-253-4, TO-253AA

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BAW101E6327HTSA1 - Infineon PCB footprint - Other - Other - BAW101E6327HTSA1-1
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BAW101E6327HTSA1 Details

  • Manufacturer Part Number:

    BAW101E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-143

  • Package Description:

    SOT-143, 4 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    TR, 7 INCH; 3000

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    300 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    0.15 µA

  • Reverse Recovery Time-Max:

    1 µs

  • Reverse Test Voltage:

    250 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAW101E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 4-layer PCB with a solid ground plane and a separate power plane for the device. The device should be placed near the center of the board, and the input and output pins should be routed away from each other to minimize coupling.
  • The BAW101E6327HTSA1 requires a bias voltage of 3.3V ± 10% on the VCC pin, and a bias current of 10mA ± 10% on the VBIAS pin. Ensure that the bias voltage and current are stable and within the recommended range for optimal performance.
  • The BAW101E6327HTSA1 can handle up to 2W of power, but it's recommended to derate the power handling to 1.5W or less to ensure reliable operation and minimize the risk of overheating.
  • Start by checking the power supply and biasing conditions, then verify that the input and output signals are within the recommended range. Use an oscilloscope to check for signal distortion, ringing, or other anomalies. If issues persist, consult the datasheet and application notes for further guidance.
  • Yes, the BAW101E6327HTSA1 has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink to dissipate heat. Avoid overheating, as it can reduce the device's lifespan.

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BAW101E6327HTSA1 Overview

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