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BAW56,215 - Nexperia

Description: NEXPERIA - BAW56,215 - Small Signal Diode, Dual Common Anode, 90 V, 215 mA, 1.25 V, 4 ns, 4 A

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Symbol
BAW56,215 - Nexperia - PCB symbol
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PCB Footprints
BAW56,215 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23[H=1.1]
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3D Models
BAW56,215 - Nexperia - 3D model - SOT23 (3-Pin) - SOT23[H=1.1]
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BAW56,215 Details

  • Manufacturer Part Number:

    BAW56,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1991-04-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    0.215 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56,215 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAW56,215 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a thermal pad of 1.1 mm x 0.6 mm. The pad should be centered on the component and have a solder mask defined gap of 0.2 mm.
  • The thermal pad of BAW56,215 should be connected to a copper plane on the PCB to improve thermal dissipation. A via or a thermal relief pattern can be used to connect the thermal pad to the copper plane.
  • The maximum allowable voltage for BAW56,215 is 250 V, but it's recommended to operate the device at a maximum voltage of 200 V to ensure reliable operation and to prevent overheating.
  • Yes, BAW56,215 can be used in switching applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) to prevent overheating and damage. The device should be derated according to the switching frequency and the maximum allowable junction temperature.
  • The power dissipation of BAW56,215 can be calculated using the formula: Pd = (Vce(sat) x Ic) + (Vbe x Ib), where Vce(sat) is the collector-emitter saturation voltage, Ic is the collector current, Vbe is the base-emitter voltage, and Ib is the base current.

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BAW56,215 Overview

Use the download button to access the BAW56,215 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BAW56, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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BAW56,215 Alternates

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Part Image BAW56-T NXP Semiconductors

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Part Image BAW56T/R Nexperia

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Part Image BAW56,185 NXP Semiconductors

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For a full list of alternate parts for BAW56,215, check out Findchips.com