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BAW56S,135 - Nexperia

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BAW56S,135 Details

  • Manufacturer Part Number:

    BAW56S,135

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-10-21

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Configuration:

    2 BANKS, COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.35 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56S,135 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for BAW56S,135 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a thermal pad of 1.5 mm x 1.5 mm. The pad should be centered on the component and have a solder mask defined gap of 0.2 mm.
  • To ensure reliable soldering of BAW56S,135, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven with a peak temperature of 240°C to 250°C.
  • The maximum power dissipation of BAW56S,135 is 250 mW. However, the actual power dissipation depends on the application and the ambient temperature. It's recommended to derate the power dissipation by 50% to ensure reliable operation.
  • Yes, BAW56S,135 can be used in switching applications, but it's essential to ensure that the switching frequency is within the recommended range of 1 kHz to 100 kHz. Additionally, the device should be operated within the recommended voltage and current ratings to prevent overheating and ensure reliable operation.
  • To handle ESD protection for BAW56S,135, use a wrist strap or an anti-static mat when handling the device. Store the device in an anti-static bag or wrap it in anti-static material. Ensure that the PCB and assembly process are ESD-safe, and use ESD-protected tools and equipment.

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BAW56S,135 Overview

Use the download button to access the BAW56S,135 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BAW56, or try a keyword search, such as Rectifier Diodes

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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