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BAW56TT1G - onsemi

Description: These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
BAW56TT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC−75/SOT−416
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BAW56TT1G - onsemi  - 3D model - SOT23 (3-Pin) - SC−75/SOT−416
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BAW56TT1G Details

  • Manufacturer Part Number:

    BAW56TT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, CASE 463-01, SC-75, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.715 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Recovery Time-Max:

    0.006 µs

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

BAW56TT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for BAW56TT1G involves keeping the leads as short as possible, using a ground plane, and minimizing the distance between the device and the PCB ground. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to reduce thermal resistance.
  • BAW56TT1G has an internal ESD protection diode, but it's still important to follow proper ESD handling procedures during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or container.
  • While BAW56TT1G is primarily designed for linear applications, it can be used in switching applications with some precautions. Ensure that the switching frequency is within the recommended range, and consider adding a snubber circuit to reduce voltage spikes and ringing.
  • The correct resistor values for BAW56TT1G depend on the specific application and desired performance. As a general guideline, use resistors with a tolerance of 1% or better, and consider the voltage drop across the resistor when selecting the value. Consult the datasheet and application notes for more information.

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BAW56TT1G Overview

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