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BB135 - NXP

Description: NXP Semiconductors BB135/SOD2///REEL 7 Q1/T1 *STANDARD MARK SMD

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Symbol
BB135 - NXP - PCB symbol
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PCB Footprints
BB135 - NXP PCB footprint - Small Outline Diode - Small Outline Diode - SOD323
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3D Models
BB135 - NXP - 3D model - Small Outline Diode - SOD323
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BB135 Details

  • Manufacturer Part Number:

    BB135

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, SMD, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Capacitance Ratio-Min:

    8.9

  • Diode Capacitance-Nom:

    19.25 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    VARIABLE CAPACITANCE DIODE

  • Frequency Band:

    ULTRA HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Variable Capacitance Diode Classification:

    ABRUPT

BB135 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11529, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The BB135 can be configured for different frequency bands using the SPI interface to program the device's registers. NXP provides a detailed description of the configuration process in the BB135 datasheet and application notes.
  • The maximum transmit power of the BB135 is +20 dBm, but it can be adjusted using the TX power control feature. The actual transmit power may vary depending on the specific application and regulatory requirements.
  • The BB135 supports antenna diversity, which can be implemented using external switches and antennas. NXP provides guidelines for antenna diversity implementation in the application note AN11529.
  • The power consumption of the BB135 varies depending on the operating mode. In transmit mode, the typical current consumption is around 120 mA, while in receive mode it's around 50 mA. In sleep mode, the current consumption is typically around 1 μA. Refer to the datasheet for detailed power consumption specifications.

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BB135 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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