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BB202,115 - NXP

Description: NXP BB202,115 Varactor, 28.2pF min, 2.5:1 Tuning Ratio, 6V, 2-Pin SOD-523

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Symbol
BB202,115 - NXP - PCB symbol
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PCB Footprints
BB202,115 - NXP PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - BB202,115
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3D Models
BB202,115 - NXP - 3D model - Small Outline Diode Flat Lead - BB202,115
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BB202,115 Details

  • Manufacturer Part Number:

    BB202,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOD

  • Package Description:

    PLASTIC, SC-79, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD523

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Diode Cap Tolerance:

    8.59%

  • Diode Capacitance Ratio-Min:

    2.5

  • Diode Capacitance-Nom:

    30.85 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    VARIABLE CAPACITANCE DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Variable Capacitance Diode Classification:

    ABRUPT

BB202,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching to minimize signal reflections.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pads. Operate the device within the specified temperature range of -40°C to 85°C.
  • Power up the device in the following sequence: VDD, then VBAT, and finally enable the clock signal. This ensures proper initialization and prevents damage to the device.
  • Use the power-down mode when the device is not in use. Optimize the clock frequency and voltage supply to minimize power consumption. Use the built-in power management features, such as dynamic voltage and frequency scaling.
  • Use ESD protection diodes or TVS diodes on the input/output pins. Ensure the PCB design includes a solid ground plane and a separate power plane. Handle the device with an anti-static wrist strap or mat.

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BB202,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Variable Capacitance Diode, 30.85pF C(T), Silicon, Abrupt