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BB914E6327HTSA1 - Infineon

Description: Infineon BB914E6327HTSA1 Dual Common Cathode Varactor Diode, 17.6pF min, 2.28:1 Tuning Ratio, 18V, 3-Pin SOT-23

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PCB Footprints
BB914E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23_2023
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3D Models
BB914E6327HTSA1 - Infineon  - 3D model - SOT23 (3-Pin) - SOT23_2023
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BB914E6327HTSA1 Details

  • Manufacturer Part Number:

    BB914E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Country Of Origin:

    Austria, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    1

  • Additional Feature:

    1.5% MATCHED SETS AVAILABLE

  • Breakdown Voltage-Min:

    18 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Cap Tolerance:

    2.86%

  • Diode Capacitance Ratio-Min:

    2.28

  • Diode Capacitance-Nom:

    43.75 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    VARIABLE CAPACITANCE DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Variable Capacitance Diode Classification:

    ABRUPT

BB914E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the BB914E6327HTSA1, which includes recommendations for PCB layout, thermal management, and component placement. It's essential to follow these guidelines to ensure optimal performance, thermal stability, and reliability.
  • The BB914E6327HTSA1 has specific power-up and power-down sequencing requirements to prevent damage or malfunction. It's crucial to follow the recommended power-up and power-down sequences outlined in the application note or datasheet to ensure safe and reliable operation.
  • While the datasheet provides recommended operating conditions, it's essential to understand the device's behavior under various environmental and operating conditions. Infineon provides application notes and technical documentation that outline the device's performance under different conditions, such as temperature, voltage, and humidity.
  • Infineon provides a range of tools and resources, including evaluation boards, software development kits, and technical support, to help troubleshoot and debug issues with the BB914E6327HTSA1. Additionally, engineers can use industry-standard debugging techniques, such as signal probing and logic analysis, to identify and resolve issues.
  • Infineon provides detailed information on the reliability and quality metrics for the BB914E6327HTSA1, including MTBF (Mean Time Between Failures), FIT (Failure in Time), and other industry-standard metrics. The device meets or exceeds relevant industry standards, such as AEC-Q100 for automotive applications, and is manufactured using rigorous quality control processes.

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BB914E6327HTSA1 Overview

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