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BBS3002-DL-1E - onsemi

Description: ON SEMICONDUCTOR - BBS3002-DL-1E. - MOSFET, P-CH, -60V, -100A, TO-263-3

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BBS3002-DL-1E - onsemi PCB footprint - Other - Other - D2PAK/TO-263-2L CASE 418AP ISSUE O
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BBS3002-DL-1E - onsemi  - 3D model - Other - D2PAK/TO-263-2L CASE 418AP ISSUE O
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BBS3002-DL-1E Details

  • Manufacturer Part Number:

    BBS3002-DL-1E

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    2

  • Manufacturer Package Code:

    418AP

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    340 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    950 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    90 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

BBS3002-DL-1E Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink if necessary, and ensure good thermal contact between the device and the heat sink. Also, follow proper PCB design and layout guidelines to minimize thermal resistance.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device. Ensure that the input voltage is within the recommended range to ensure reliable operation.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • The recommended operating frequency range for the BBS3002-DL-1E is up to 100 kHz. Operating the device beyond this frequency range may affect its performance and reliability.

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BBS3002-DL-1E Overview

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