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BD00IA5MEFJ-ME2 - ROHM Semiconductor

Description: 0.5A Variable LDO Regulator HTSOP-J8

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BD00IA5MEFJ-ME2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-3
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BD00IA5MEFJ-ME2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP-J8-3
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BD00IA5MEFJ-ME2 Details

  • Manufacturer Part Number:

    BD00IA5MEFJ-ME2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HTSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.9 V

  • Dropout Voltage1-Nom:

    0.4 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max (%/V):

    1.31

  • Load Regulation-Max:

    9.375%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    4.5 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

BD00IA5MEFJ-ME2 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal relief pattern and a minimum of 2oz copper thickness to ensure optimal thermal performance. A thermal via array under the IC can also help to improve heat dissipation.
  • To ensure stable operation with a single-supply voltage, it is recommended to use a decoupling capacitor (e.g., 10uF) between the VIN pin and GND, and to minimize the impedance of the power supply lines.
  • The maximum allowed power dissipation for the BD00IA5MEFJ-ME2 is 1.5W. Exceeding this limit may cause the device to overheat and potentially fail.
  • The BD00IA5MEFJ-ME2 is rated for operation up to 125°C. However, it is recommended to derate the power dissipation at higher temperatures to ensure reliable operation. Consult the datasheet for more information.
  • Check the input voltage, ensure that the EN pin is high, and verify that the VIN pin is within the recommended operating range. Also, check for any short circuits or incorrect PCB layout that may prevent the device from turning on.

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BD00IA5MEFJ-ME2 Overview

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