BD18351EFV-ME2 - ROHM Semiconductor

BD18351EFV-ME2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
• How do I ensure stable operation with a high-capacitance output capacitor?
  To ensure stable operation with a high-capacitance output capacitor, it is recommended to add a series resistor (Rs) and a capacitor (Cc) in parallel with the output capacitor to form a damping circuit. This helps to prevent oscillation and ensure stable operation.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may cause damage to the device.
• Can I use the BD18351EFV-ME2 in a high-temperature environment?
  Yes, the BD18351EFV-ME2 is rated for operation up to 105°C. However, the device's power dissipation and junction temperature should be carefully considered to ensure reliable operation.
• How do I calculate the output voltage ripple?
  The output voltage ripple can be calculated using the following formula: ΔVout = (Iout x ESL) / (Cout x fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.