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BD18378EFV-ME2 - ROHM Semiconductor

Description: ROHM - BD18378EFV-ME2 - LED DRIVER, CONSTANT CURRENT, HTSSOP-28

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BD18378EFV-ME2 - ROHM Semiconductor - PCB symbol
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PCB Footprints
BD18378EFV-ME2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSSOP-B28 _
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BD18378EFV-ME2 - ROHM Semiconductor - 3D model - Small Outline Packages - HTSSOP-B28 _
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BD18378EFV-ME2 Details

  • Manufacturer Part Number:

    BD18378EFV-ME2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HTSSOP-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    12

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    4.4 mm

  • fmax-Min:

    1.25 MHz

BD18378EFV-ME2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the IC to the ground plane. This helps to dissipate heat efficiently.
  • To ensure stable output voltage regulation, it is recommended to use a high-quality output capacitor with low ESR, and to follow the recommended PCB layout guidelines. Additionally, the input voltage should be well-regulated and free from noise.
  • The maximum allowable ripple voltage on the input is typically 10% of the nominal input voltage. Exceeding this limit may affect the stability of the output voltage regulation.
  • The BD18378EFV-ME2 is rated for operation up to 105°C. However, the maximum operating temperature may be limited by the specific application and the thermal design of the system. It is recommended to consult the datasheet and to perform thermal simulations to ensure reliable operation.
  • To protect the regulator from input voltage surges, it is recommended to use a TVS (Transient Voltage Suppressor) diode or a varistor in parallel with the input capacitor. This helps to clamp the input voltage and prevent damage to the regulator.

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BD18378EFV-ME2 Overview

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