BD18397RUV-ME2 - ROHM Semiconductor

BD18397RUV-ME2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
• How do I ensure stable operation with a high-ESR output capacitor?
  To ensure stable operation with a high-ESR output capacitor, ROHM recommends using a capacitor with an ESR of 10Ω or less, and adding a 1nF to 10nF ceramic capacitor in parallel to the output capacitor to improve stability.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6V, which is the same as the maximum rating for the VCC pin. Applying a voltage higher than 6V on the EN pin can cause damage to the device.
• Can I use the BD18397RUV-ME2 in a high-temperature environment?
  The BD18397RUV-ME2 is rated for operation up to 105°C, but ROHM recommends derating the output current and voltage to ensure reliable operation at high temperatures. Consult the datasheet and ROHM's application notes for more information.
• How do I calculate the power dissipation of the device?
  To calculate the power dissipation of the BD18397RUV-ME2, use the following formula: Pd = (Vin x Iin) + (Vout x Iout) + (Vcc x Icc). Consult the datasheet for the relevant current and voltage values.