Part Image

BD33GA5MEFJ-ME2 - ROHM Semiconductor

Description: ROHM BD33GA5MEFJ-ME2, LDO Regulator, 500mA, 3.3 V, ±1% 8-Pin, HTSOP

Download BD33GA5MEFJ-ME2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BD33GA5MEFJ-ME2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-4
click to zoom
3D Models
BD33GA5MEFJ-ME2 - ROHM Semiconductor  - 3D model - Small Outline Packages - HTSOP-J8-4
click to zoom

BD33GA5MEFJ-ME2 Details

  • Manufacturer Part Number:

    BD33GA5MEFJ-ME2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HTSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.2 V

  • Dropout Voltage1-Nom:

    0.6 V

  • Input Voltage Absolute-Max:

    15 V

  • Input Voltage-Max:

    14 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.05%

  • Load Regulation-Max(%):

    0.075%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.399 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, EMBOSSED

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    3.9 mm

BD33GA5MEFJ-ME2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, and to use thermal vias to dissipate heat to the bottom layer of the PCB.
  • To ensure stable operation over the entire operating temperature range, it is recommended to follow the recommended operating conditions, use a stable input voltage, and ensure proper thermal management.
  • To prevent damage, it is recommended to handle the device by the body, avoid touching the pins, store the device in an anti-static bag, and avoid exposing it to high temperatures or humidity.
  • Yes, the BD33GA5MEFJ-ME2 is a high-reliability device suitable for use in automotive and industrial applications, but it is recommended to follow the recommended operating conditions and to perform thorough testing and validation.
  • To troubleshoot issues with the device, it is recommended to check the input voltage, output voltage, and current consumption, and to verify that the device is operated within the recommended operating conditions.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BD33GA5MEFJ-ME2 Overview

Use the download button to access the BD33GA5MEFJ-ME2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BD33G, or try a keyword search, such as Linear Regulator ICs

Parts related to BD33GA5MEFJ-ME2

Showing 0 results