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BD50C0AFP-CE2 - ROHM Semiconductor

Description: 35V Voltage 1A LDO Regulator TO252-3

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BD50C0AFP-CE2 - ROHM Semiconductor PCB footprint - Other - Other - TO-252-3_1
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BD50C0AFP-CE2 - ROHM Semiconductor  - 3D model - Other - TO-252-3_1
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BD50C0AFP-CE2 Details

  • Manufacturer Part Number:

    BD50C0AFP-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    35 V

  • Input Voltage-Max:

    26.5 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-PSSO-G2

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.08%

  • Load Regulation-Max:

    0.1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    5.15 V

  • Output Voltage1-Min:

    4.85 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3%

  • Width:

    5.5 mm

BD50C0AFP-CE2 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Use a capacitor with an ESR of 10 ohms or less, and add a 1-10nF ceramic capacitor in parallel to the output capacitor to improve stability.
  • The maximum input voltage is 28V, but it's recommended to keep it below 24V for reliable operation.
  • The device is rated for operation up to 125°C, but derating is required above 85°C. Ensure proper thermal design and heat sinking to maintain reliability.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and add a 10nF-100nF capacitor between VIN and GND to reduce EMI.

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