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BD6517F-E2 - ROHM Semiconductor

Description: ROHM BD6517F-E2, Quad USB Power Switch High Side, 110mΩ, 2.7 V min., 8-Pin SOP

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PCB Footprints
BD6517F-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-08-2021
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3D Models
BD6517F-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-08-2021
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BD6517F-E2 Details

  • Manufacturer Part Number:

    BD6517F-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    CONTROL LOGIC: ACTIVE LOW

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    1.65 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    20 µs

  • Turn-on Time:

    6000 µs

  • Width:

    4.4 mm

BD6517F-E2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BD6517F-E2 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces under the device, and keep the thermal pad connected to a solid ground plane.
  • To ensure stable output voltage regulation, make sure to decouple the input and output with suitable capacitors (e.g., 10uF ceramic capacitors). Also, ensure the output capacitor is properly sized for the desired output voltage and load current. Additionally, consider adding a soft-start circuit to prevent inrush currents during startup.
  • For the BD6517F-E2, a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7uF to 10uF is recommended. This helps to filter out high-frequency noise and ensures stable operation.
  • Implement overcurrent protection (OCP) and overvoltage protection (OVP) circuits to prevent damage from excessive current or voltage. Also, consider adding thermal monitoring and shutdown circuits to prevent overheating. ROHM Semiconductor provides guidelines for OCP and OVP in their application notes.
  • The BD6517F-E2 is rated for operation from -40°C to 105°C (ambient temperature). However, for optimal performance and reliability, it's recommended to operate the device within a temperature range of 0°C to 85°C.

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