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BD82065FVJ-E2 - ROHM Semiconductor

Description: High-Side Power Switch,2.4A,TSSOP-B8J

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BD82065FVJ-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-B8J_2021
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3D Models
BD82065FVJ-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - TSSOP-B8J_2021
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BD82065FVJ-E2 Details

  • Manufacturer Part Number:

    BD82065FVJ-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Similar Group:

    DR071013YYYY10701120

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.05

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    1 A

  • Output Peak Current Limit-Nom:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    40 µs

  • Turn-on Time:

    20000 µs

  • Width:

    3 mm

BD82065FVJ-E2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a thermal relief pattern on the bottom layer and a solid ground plane on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure stable output voltage regulation, it's essential to follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, decoupling capacitors should be placed close to the IC, and the input capacitor should be a low-ESR type.
  • The maximum allowable input voltage ripple for the BD82065FVJ-E2 is 10% of the input voltage. Exceeding this limit may affect the IC's performance and stability.
  • The BD82065FVJ-E2 is rated for operation up to 105°C. However, it's essential to consider the IC's power dissipation and thermal management when operating in high-temperature environments. A heat sink or thermal pad may be necessary to ensure reliable operation.
  • To troubleshoot issues with the overcurrent protection feature, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly connected and that the output current is within the specified limit. Also, verify that the IC is not overheating, which can trigger the overcurrent protection feature.

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