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BD87582YFVM-CTR - ROHM Semiconductor

Description: Operational Amplifiers - Op Amps RAIL-TO-RAIL CMOS

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BD87582YFVM-CTR - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-08
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BD87582YFVM-CTR - ROHM Semiconductor  - 3D model - Small Outline Packages - MSOP-08
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BD87582YFVM-CTR Details

  • Manufacturer Part Number:

    BD87582YFVM-CTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-06-30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    45 dB

  • Common-mode Reject Ratio-Nom:

    60 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    3.5 V/us

  • Supply Current-Max:

    8 mA

  • Supply Voltage Limit-Max:

    15.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    1778

  • Wideband:

    NO

  • Width:

    2.8 mm

BD87582YFVM-CTR Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a thermal relief pattern on the bottom layer to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended for the thermal pad.
  • To ensure stable operation, ROHM recommends using an output capacitor with a capacitance value between 10uF to 100uF, and an ESR (Equivalent Series Resistance) of less than 10mΩ. Additionally, a 1uF ceramic capacitor in parallel with the output capacitor can help reduce noise and oscillation.
  • ROHM recommends using a 1uF to 10uF ceramic capacitor with an X7R or X5R dielectric as the input capacitor. This helps to filter out noise and ensure stable operation.
  • ROHM recommends using a voltage supervisor or a reset IC to monitor the input voltage and reset the system in case of overvoltage or undervoltage conditions. Additionally, a TVS (Transient Voltage Suppressor) diode can be used to protect the device from voltage spikes and surges.
  • ROHM recommends using a thermal interface material with a thermal conductivity of at least 1 W/m-K, such as a thermal pad or thermal tape, to ensure efficient heat transfer between the device and the heat sink.

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