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BD9329AEFJ-E2 - ROHM Semiconductor

Description: Step-down S/W Regulator,0.9 to Vin*0.7V

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BD9329AEFJ-E2 - ROHM Semiconductor - PCB symbol
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BD9329AEFJ-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - HTSOP-J8-4
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BD9329AEFJ-E2 - ROHM Semiconductor - 3D model - Small Outline Packages - HTSOP-J8-4
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BD9329AEFJ-E2 Details

  • Manufacturer Part Number:

    BD9329AEFJ-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    HTSOP

  • Package Description:

    4.90 X 6 MM, 1 MM HEIGHT, HTSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.9 V TO 12.6 V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    4.2 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSOP

  • Package Equivalence Code:

    TSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    380 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

BD9329AEFJ-E2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BD9329AEFJ-E2 should include a solid ground plane, wide power traces, and a thermal relief pattern under the IC to facilitate heat dissipation. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stable operation with a high-ESR output capacitor, it's recommended to add a 1-10nF ceramic capacitor in parallel with the output capacitor to reduce the ESR. Additionally, the output capacitor should be placed close to the IC to minimize the loop inductance.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the IC. It's recommended to use a voltage divider or a level shifter to ensure the EN pin voltage does not exceed 6V.
  • The output voltage ripple can be calculated using the following formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
  • A 10-22uF ceramic or electrolytic capacitor with a low ESR is recommended for the input capacitor. The capacitor should be placed close to the IC to minimize the loop inductance.

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BD9329AEFJ-E2 Overview

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