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BF1100R,215 - NXP

Description: MOSFET N-CH 14V 30MA SOT143

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BF1100R,215 - NXP PCB footprint - Other - Other - BF1100R,215-2
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BF1100R,215 Details

  • Manufacturer Part Number:

    BF1100R,215

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MICRO MINIATURE, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    SOURCE

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    14 V

  • Drain Current-Max (ID):

    0.03 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    0.035 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    DUAL GATE, ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF1100R,215 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the application note AN11542. It's essential to follow these guidelines to ensure proper heat dissipation and minimize thermal resistance.
  • To optimize the BF1100R,215 for low power consumption, use the lowest possible supply voltage, reduce the operating frequency, and enable power-saving features like dynamic voltage and frequency scaling (DVFS). Additionally, use the built-in power management unit (PMU) to control power domains and reduce leakage current.
  • The BF1100R,215's ADC has limitations in terms of sampling rate, resolution, and input range. The ADC can sample up to 1.2 MSPS, has a resolution of 12 bits, and an input range of 0 to 3.3V. Additionally, the ADC has a limited number of channels and may require calibration for optimal performance.
  • NXP provides a secure boot and firmware update solution through its Secure Firmware Update (SFU) tool. The BF1100R,215 has a built-in secure boot mechanism that ensures the authenticity and integrity of the firmware. Use the SFU tool to create secure firmware images and implement secure firmware updates.
  • The BF1100R,215 is a more powerful and feature-rich microcontroller compared to the LPC1100 series. It has a higher clock speed, more memory, and additional peripherals like the ADC and DAC. The BF1100R,215 is also more power-efficient and has a more advanced power management system.

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BF1100R,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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