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BF722,115 - Nexperia

Description: Bipolar Transistors - BJT TRANS HV TAPE-7 BF720; BF722 NPN high-voltage transistors

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PCB Footprints
BF722,115 - Nexperia PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223 (SC-73)
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3D Models
BF722,115 - Nexperia  - 3D model - SOT223 (3-Pin) - SOT223 (SC-73)
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BF722,115 Details

  • Manufacturer Part Number:

    BF722,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-73

  • Package Description:

    PLASTIC, SMD, SC-73, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.75

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    1.6 pF

  • Collector-Emitter Voltage-Max:

    250 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    60 MHz

  • VCEsat-Max:

    0.6 V

BF722,115 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Use a low-ESR capacitor (e.g., 100 nF) close to the device's power pins to decouple the supply voltage. Additionally, use a 50 Ω transmission line impedance to minimize signal reflections.
  • The device is rated for operation from -40°C to 150°C (junction temperature). However, for reliable operation, it's recommended to keep the junction temperature below 125°C.
  • Use an ESD protection diode (e.g., 1.5 kΩ, 1% tolerance) between the input pins and the power supply pins. Also, ensure that the PCB design includes ESD protection features, such as a ground plane and ESD-sensitive component placement.
  • A 50 Ω input impedance is recommended to match the device's output impedance and minimize signal reflections.

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BF722,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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