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BF824,215 - Nexperia

Description: BF824 - PNP medium frequency transistor

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BF824,215 Details

  • Manufacturer Part Number:

    BF824,215

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC, SST, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    4

  • Collector Current-Max (IC):

    0.025 A

  • Collector-Base Capacitance-Max:

    0.3 pF

  • Collector-Emitter Voltage-Max:

    30 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    25

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    450 MHz

BF824,215 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A 2-3 layer PCB with a solid ground plane is recommended. Avoid thermal vias under the package.
  • Use a low-ESR capacitor (e.g., 100nF) between VCC and GND, and a 10-22uF capacitor between VCC and AVCC. Ensure a stable power supply and minimize noise on the power lines.
  • Use a 100nF capacitor between VCC and GND, and a 10uF capacitor between VCC and AVCC. Place decoupling capacitors as close as possible to the IC, and use a low-ESR capacitor for high-frequency decoupling.
  • Use ESD protection diodes (e.g., 1.5KE6.8A) on the input lines, and ensure the PCB design includes a clear path for ESD discharge to ground. Follow the IEC 61000-4-2 standard for ESD testing.
  • The device has a thermal shutdown at 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Monitor the device temperature and reduce power consumption if necessary.

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BF824,215 Overview

Use the download button to access the BF824,215 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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For a full list of alternate parts for BF824,215, check out Findchips.com