- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for BFC237261103
- Part Number BFC237261103
- Manufacturer Vishay
- Pin Count 2
- Part Category Capacitor
- Package Category Other
- Footprint Name Other - BFC237261103-4
- Released Date Feb 4, 2024
- Last Modified Date Feb 5, 2024 6:25 AM UTC
- Pinout / Pin List Click Here (Member Only)
BFC237261103 Details
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Manufacturer Part Number:
BFC237261103
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
RADIAL LEADED
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8532.25.00.70
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.87
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Capacitance:
0.01 µF
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Capacitor Type:
FILM CAPACITOR
BFC237261103 Frequently Asked Questions (FAQs)
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A symmetrical layout with a central grounding point is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance. Additionally, keeping the component away from high-frequency signals and using a solid ground plane can help reduce noise and improve overall performance.
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The BFC237261103 has a high power dissipation rating, so proper thermal management is crucial. Ensure good airflow around the component, and consider using a heat sink or thermal pad to dissipate heat. The component's thermal resistance (Rth) is specified in the datasheet, which can help with thermal design calculations.
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Vishay recommends soldering the BFC237261103 using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Hand soldering is not recommended due to the component's small size and high power rating. Ensure that the soldering process is done in accordance with the IPC-J-STD-020 standard.
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While the BFC237261103 is a high-quality component, it may not meet the specific requirements for high-reliability or aerospace applications. Vishay offers specialized components and screening options for these applications, such as the 'S' or 'T' suffix. Consult with Vishay's application engineers or review their documentation for more information.
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The BFC237261103 is a moisture-sensitive device (MSD). Store the component in its original packaging or a dry, nitrogen-filled environment to prevent moisture absorption. Handle the component with care, avoiding exposure to high humidity or temperature fluctuations. Follow the IPC/JEDEC J-STD-033 standard for handling and storage of MSDs.
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BFC237261103 Overview
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