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BFG591,115 - NXP

Description: RF Transistor NPN 15V 200mA 7GHz 2W Surface Mount SC-73

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PCB Footprints
BFG591,115 - NXP PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223
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3D Models
BFG591,115 - NXP  - 3D model - SOT223 (3-Pin) - SOT223
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BFG591,115 Details

  • Manufacturer Part Number:

    BFG591,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-73

  • Package Description:

    PLASTIC, SC-73, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE, HIGH RELIABILITY

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    1.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    7000 MHz

BFG591,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use 50-ohm transmission lines for the RF signals.
  • The BFG591,115 requires a bias voltage of 5V and a bias current of 10mA. Ensure the bias circuit is decoupled from the RF circuitry and use a low-noise voltage regulator to minimize noise.
  • The BFG591,115 can handle up to 2W of RF power. Exceeding this limit may cause damage to the device or affect its performance.
  • Use a pi-network or a T-network topology for impedance matching. The input impedance is typically 50 ohms, and the output impedance is typically 200 ohms. Use simulation tools or impedance matching software to optimize the matching network.
  • The BFG591,115 operates from -40°C to 85°C. Ensure proper thermal management and heat sinking to maintain optimal performance and reliability.

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BFG591,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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