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BFG591 - NXP

Description: NPN 7 GHz wideband transistor

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BFG591 Details

  • Manufacturer Part Number:

    BFG591

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-73

  • Package Description:

    PLASTIC, SC-73, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY, LOW NOISE

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    1.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    7000 MHz

BFG591 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFG591 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the BFG591 for low noise performance, use a low-noise power supply, minimize the length of the input and output tracks, and use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • The maximum power dissipation of the BFG591 is dependent on the package type and the ambient temperature. For the SOT122 package, the maximum power dissipation is 1.4 W at 25°C. For the SOT223 package, it is 2.5 W at 25°C.
  • To protect the BFG591 from ESD, handle the device by the body, use an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Avoid touching the device pins or exposing it to high-voltage sources.
  • The recommended operating voltage range for the BFG591 is 4.75 V to 5.25 V. Operating the device outside this range may affect its performance and reliability.

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BFG591 Overview

Use the download button to access the BFG591 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BFG59, or try a keyword search, such as Other Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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