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BFP450H6327XTSA1 - Infineon

Description: RF Bipolar Transistors RF BIP TRANSISTOR

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BFP450H6327XTSA1 - Infineon PCB footprint - Other - Other - BFP450H6327XTSA1-1
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BFP450H6327XTSA1 Details

  • Manufacturer Part Number:

    BFP450H6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOT-343, 4 PIN

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    EMITTER

  • Collector Current-Max (IC):

    0.17 A

  • Collector-Base Capacitance-Max:

    0.8 pF

  • Collector-Emitter Voltage-Max:

    4.5 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • Highest Frequency Band:

    S BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    24000 MHz

BFP450H6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the package to ensure good heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design and layout guidelines. Additionally, consider using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK to improve heat transfer between the device and the heat sink.
  • The maximum allowed voltage on the VCC pin is 5.5 V. Exceeding this voltage may damage the device.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an ESD wrist strap or mat. Ensure that the assembly line and equipment are also ESD-protected.
  • Store the device in a dry, cool place with a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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BFP450H6327XTSA1 Overview

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