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BFQ19,115 - NXP

Description: RF TRANS NPN 15V 5.5GHZ SOT89-3

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PCB Footprints
BFQ19,115 - NXP PCB footprint - Other - Other - BFQ19,115-3
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BFQ19,115 - NXP  - 3D model - Other - BFQ19,115-3
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BFQ19,115 Details

  • Manufacturer Part Number:

    BFQ19,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-89

  • Package Description:

    PLASTIC, SC-62, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT89

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.75

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    1.6 pF

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    25

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-243

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    1 W

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    CECC

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    5500 MHz

BFQ19,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Use a thermally conductive material for the heat sink, ensure good airflow, and consider using a thermal interface material to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
  • Use a common mode choke, a differential mode inductor, and a capacitor with a high self-resonant frequency to filter out EMI. Ensure the filter components are placed close to the BFQ19,115 and the PCB layout is optimized for minimal radiation.
  • Use a pi-network or a T-network topology for impedance matching. Calculate the optimal component values using a Smith chart or a network analyzer. Ensure the impedance matching is optimized for the specific frequency range of operation.
  • Ensure good airflow, use a heat sink with a high thermal conductivity, and apply a thermal interface material. Monitor the junction temperature and adjust the operating conditions to prevent overheating.

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BFQ19,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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