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BFS540,115 - NXP

Description: RF TRANS NPN 15V 9GHZ SOT323-3

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PCB Footprints
BFS540,115 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3 lead sot-23
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3D Models
BFS540,115 - NXP  - 3D model - SOT23 (3-Pin) - 3 lead sot-23
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BFS540,115 Details

  • Manufacturer Part Number:

    BFS540,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70

  • Package Description:

    PLASTIC, UMT3, SC-70, CMPAK-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Collector Current-Max (IC):

    0.12 A

  • Collector-Base Capacitance-Max:

    0.9 pF

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PSSO-G3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.5 W

  • Power Dissipation-Max (Abs):

    0.5 W

  • Power Gain-Min (Gp):

    2.4 dB

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    9000 MHz

BFS540,115 Frequently Asked Questions (FAQs)

  • The BFS540,115 can operate up to 2.7 GHz, making it suitable for a wide range of applications, including wireless infrastructure, satellite communications, and radar systems.
  • To optimize the biasing of the BFS540,115, it is recommended to use a voltage-controlled current source to set the bias current, and to adjust the bias voltage to achieve the desired output power and efficiency. The optimal biasing conditions may vary depending on the specific application and operating frequency.
  • The BFS540,115 is capable of delivering up to 10 W of output power, making it suitable for high-power applications such as wireless infrastructure and satellite communications.
  • Thermal management is critical for the BFS540,115, as it can operate at high temperatures. It is recommended to use a heat sink or thermal pad to dissipate heat, and to ensure good airflow around the device. The maximum junction temperature of the BFS540,115 is 150°C.
  • The typical noise figure of the BFS540,115 is around 1.5 dB, making it suitable for applications that require low noise figure, such as satellite communications and radar systems.

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BFS540,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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