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BFT25A,215 - NXP

Description: PNP transistor in a plastic SOT23

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PCB Footprints
BFT25A,215 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23
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3D Models
BFT25A,215 - NXP  - 3D model - SOT23 (3-Pin) - SOT23
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BFT25A,215 Details

  • Manufacturer Part Number:

    BFT25A,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Date Of Intro:

    1992-11-01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Collector Current-Max (IC):

    0.0065 A

  • Collector-Base Capacitance-Max:

    0.45 pF

  • Collector-Emitter Voltage-Max:

    5 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.032 W

  • Power Dissipation-Max (Abs):

    0.032 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    CECC

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    5000 MHz

BFT25A,215 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFT25A,215 should include a large copper area for heat dissipation, with multiple vias connecting the top and bottom layers to reduce thermal resistance. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the device. Additionally, ensure good thermal design, use a heat sink if necessary, and consider using a thermal interface material to improve heat transfer.
  • Monitor the device's junction temperature, current, and voltage to detect potential faults. Implement over-temperature protection, over-current protection, and under-voltage lockout to prevent damage and ensure reliable operation.
  • To optimize the BFT25A,215 for low power consumption, use a low-dropout voltage regulator, minimize the input voltage, and optimize the PCB layout to reduce power losses. Consider using a power-saving mode or dynamic voltage scaling if possible.
  • To protect the BFT25A,215 from electrostatic discharge (ESD), use ESD-sensitive handling and storage procedures. Implement ESD protection circuits, such as TVS diodes or ESD arrays, on the PCB, and ensure that the device is properly grounded.

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BFT25A,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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For a full list of alternate parts for BFT25A,215, check out Findchips.com