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BGA6130 - NXP

Description: NXP Semiconductors BGA6130/HVSON8///REEL 13 Q1/T1 *STANDARD MARK SMD

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PCB Footprints
BGA6130 - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT908-3 (HVSON8)+
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3D Models
BGA6130 - NXP  - 3D model - Small Outline No-lead - SOT908-3 (HVSON8)+
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BGA6130 Details

  • Manufacturer Part Number:

    BGA6130

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    3 X 3 MM, 0.85 MM HEIGHT, LEADLESS, SURFACE MOUNT, THIN, PLASTIC, SOT-908-3, MO-229, HVSON-8

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    11 dB

  • Input Power-Max (CW):

    15 dBm

  • Operating Frequency-Max:

    2700 MHz

  • Operating Frequency-Min:

    400 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

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BGA6130 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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