BGSF110GN26 - Infineon

BGSF110GN26 Details

• Manufacturer Part Number:

  BGSF110GN26

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  3.40 X 2.60 MM, 0.73 MM HEIGHT, GREEN, PLASTIC, TSNP-26

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  0

• JESD-30 Code:

  R-PQCC-N26

• Length:

  3.4 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Terminals:

  26

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -30 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Seated Height-Max:

  0.77 mm

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Telecom IC Type:

  TELECOM CIRCUIT

• Temperature Grade:

  OTHER

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  2.6 mm