BGT24MR2E6327XUMA1 - Infineon

BGT24MR2E6327XUMA1 Details

• Manufacturer Part Number:

  BGT24MR2E6327XUMA1

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  ROHS COMPLIANT, PLASTIC, VQFN-32

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  0

• JESD-30 Code:

  R-PQCC-N32

• JESD-609 Code:

  e3

• Length:

  5.5 mm

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  32

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Seated Height-Max:

  0.9 mm

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  BIPOLAR

• Telecom IC Type:

  TELECOM CIRCUIT

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Width:

  4.5 mm