BH2223FV-E2 - ROHM Semiconductor

BH2223FV-E2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
• How do I ensure stable operation with a high-impedance output load?
  To ensure stable operation with a high-impedance output load, add a 10nF to 100nF capacitor in parallel with the output to reduce ringing and oscillation. Additionally, consider adding a series resistor (e.g., 10Ω to 100Ω) to the output to dampen the load.
• What is the maximum allowed voltage on the enable pin (EN)?
  Although the datasheet doesn't specify a maximum voltage for the enable pin (EN), it's recommended to keep it within the VCC range (i.e., 2.5V to 5.5V) to ensure proper operation and prevent damage to the device.
• Can I use the BH2223FV-E2 as a high-side switch?
  Yes, the BH2223FV-E2 can be used as a high-side switch. However, ensure that the input voltage (VIN) is within the recommended range (2.5V to 5.5V) and that the output voltage (VOUT) doesn't exceed the input voltage. Also, consider adding a pull-down resistor to the output to prevent it from floating when the device is disabled.
• How do I calculate the power dissipation of the BH2223FV-E2?
  To calculate the power dissipation, use the following formula: Pd = (VIN - VOUT) x IOUT x Rds(on). Rds(on) is the on-state resistance, which can be found in the datasheet. Consider the worst-case scenario with maximum input voltage, output current, and Rds(on) to ensure safe operation.