BLM21HE472BH1L - Murata Electronics

BLM21HE472BH1L Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the BLM21HE472BH1L?
  The recommended land pattern for the BLM21HE472BH1L is a rectangular pad with a size of 2.5mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. This can be found in the Murata Land Pattern Recommendation document.
• How do I handle the BLM21HE472BH1L's sensitivity to soldering conditions?
  To minimize the risk of damage during soldering, it's recommended to follow the Murata Soldering Conditions guidelines, which specify a peak temperature of 260°C, a soldering time of 3 seconds or less, and a soldering iron temperature of 350°C or less.
• What is the BLM21HE472BH1L's operating temperature range?
  The BLM21HE472BH1L has an operating temperature range of -40°C to +125°C, making it suitable for a wide range of applications.
• Is the BLM21HE472BH1L RoHS and REACH compliant?
  Yes, the BLM21HE472BH1L is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, making it suitable for use in EU-based applications.
• What is the BLM21HE472BH1L's moisture sensitivity level (MSL)?
  The BLM21HE472BH1L has a moisture sensitivity level (MSL) of 1, which means it can withstand a maximum of 30 days in a humidity-controlled environment before soldering.