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BM2P063HK-LBZ - ROHM Semiconductor

Description: PWM Type DC/DC Converter IC Integrated Switching MOSFET 30V,-40 °C to +105 °C

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PCB Footprints
BM2P063HK-LBZ - ROHM Semiconductor PCB footprint - Other - Other - DIP7AK_2026
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3D Models
BM2P063HK-LBZ - ROHM Semiconductor  - 3D model - Other - DIP7AK_2026
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BM2P063HK-LBZ Details

  • Manufacturer Part Number:

    BM2P063HK-LBZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-7

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    32 Weeks

  • Date Of Intro:

    2020-10-19

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    10.9 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDIP-T7

  • Length:

    9.27 mm

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.001 A

  • Package Body Material:

    PLASTIC

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP7,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Seated Height-Max:

    5.33 mm

  • Supply Current-Max (Isup):

    0.0016 mA

  • Surface Mount:

    NO

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    68.5 kHz

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

BM2P063HK-LBZ Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) connecting to a solid copper plane on the bottom layer. This ensures efficient heat dissipation.
  • Choose an input capacitor with a minimum capacitance of 10uF and a maximum ESR of 100mΩ. The capacitor should be placed as close as possible to the device. ROHM recommends a ceramic capacitor with an X7R or X5R dielectric.
  • ROHM recommends an output capacitor with a minimum capacitance of 22uF and a maximum ESR of 50mΩ. A ceramic capacitor with an X7R or X5R dielectric is suitable for this application.
  • Monitor the device's junction temperature (TJ) and ensure it remains within the recommended range of -40°C to 125°C. Use thermal simulation tools or thermal cameras to estimate the junction temperature during operation.
  • ROHM recommends a PCB material with a high thermal conductivity, such as FR4 or IMS. The recommended PCB thickness is 1.6mm or thicker to ensure efficient heat dissipation.

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BM2P063HK-LBZ Overview

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