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BM6112FV-CE2 - ROHM Semiconductor

Description: Isolation Voltage 3750 Vrms 1ch Gate Driver Providing Galvanic Isolation

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BM6112FV-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - BM6112FV-CE2
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BM6112FV-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - BM6112FV-CE2
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BM6112FV-CE2 Details

  • Manufacturer Part Number:

    BM6112FV-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

BM6112FV-CE2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Use a decoupling capacitor (e.g., 10uF) between VCC and GND, and a 0.1uF capacitor between AVCC and AGND. Ensure the power supply has a low impedance and can provide sufficient current.
  • The maximum clock frequency is 32MHz, but it can be overclocked up to 40MHz with careful PCB design and component selection.
  • The POR and BOR functions are enabled by default. To disable them, tie the POR/BOR pin to VCC. For custom reset behavior, use external resistors and capacitors to adjust the reset timing.
  • Use a 12MHz crystal oscillator with a 22pF capacitor between the XTAL1 and XTAL2 pins, and a 1MΩ resistor between XTAL1 and GND.

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BM6112FV-CE2 Overview

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