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BM61S40RFV-CE2 - ROHM Semiconductor

Description: Gate Drivers 3750VRMS 1CH GATE DRIVER

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BM61S40RFV-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-B10W
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BM61S40RFV-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SSOP-B10W
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BM61S40RFV-CE2 Details

  • Manufacturer Part Number:

    BM61S40RFV-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SSOP-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Date Of Intro:

    2018-05-23

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8.1

  • Additional Feature:

    SUPPLY CURRENT 2 IS 2mA

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • Length:

    8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP10,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.9 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    16 V

  • Supply Voltage1-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.065 µs

  • Width:

    3.5 mm

BM61S40RFV-CE2 Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note AN1191, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • ROHM provides a component selection guide in their datasheet, which includes recommendations for capacitors, resistors, and inductors. Additionally, engineers can use online tools and simulation software to optimize component selection for their specific application.
  • While the datasheet specifies an operating temperature range of -40°C to 105°C, ROHM recommends derating the device's performance at high temperatures. Engineers should consult ROHM's thermal management guidelines to ensure reliable operation within their specific application's temperature range.
  • ROHM provides troubleshooting guidelines in their application notes and FAQs. Engineers can also consult online forums and communities, as well as ROHM's technical support team, to diagnose and resolve common issues.
  • Yes, ROHM recommends following EMI/EMC guidelines to minimize electromagnetic interference and ensure compliance with regulatory standards. Engineers should consult ROHM's application notes and follow best practices for PCB design, component selection, and shielding to minimize EMI/EMC issues.

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BM61S40RFV-CE2 Overview

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