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BM64SPKS1MC2-0001AA - Microchip

Description: BT4.2 Stereo Audio with BLE, I2S, Flash,

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BM64SPKS1MC2-0001AA - Microchip - PCB symbol
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PCB Footprints
BM64SPKS1MC2-0001AA - Microchip PCB footprint - Other - Other - BM64SPKS1MC2-0001AA-1
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BM64SPKS1MC2-0001AA - Microchip - 3D model - Other - BM64SPKS1MC2-0001AA-1
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BM64SPKS1MC2-0001AA Details

  • Manufacturer Part Number:

    BM64SPKS1MC2-0001AA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODULE-43

  • Pin Count:

    43

  • Manufacturer Package Code:

    MODULE-43

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    5A992.C

  • HTS Code:

    8529.90.22.00

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2017-10-19

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • JESD-30 Code:

    R-XXMA-N43

  • Length:

    32 mm

  • Number of Terminals:

    43

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.5 mm

  • Supply Voltage-Max:

    4.2 V

  • Supply Voltage-Min:

    3.2 V

  • Supply Voltage-Nom:

    3.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.2 mm

  • Terminal Position:

    UNSPECIFIED

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

BM64SPKS1MC2-0001AA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency and data transmission rates are within the specified limits. Also, use a common ground point and ensure that the signal lines are properly terminated.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and use a heat sink if necessary. Also, avoid overheating the device during soldering and rework.
  • Use a logic analyzer or oscilloscope to debug the issue. Check the power supply voltage, clock frequency, and data transmission rates. Also, consult the datasheet and application notes for troubleshooting guidelines.
  • The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is properly grounded.

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BM64SPKS1MC2-0001AA Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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