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BMR4912510/871 - Flex Power Modules

Description: 1300-2450 W quarter brick digital isolated DC/DC converter for datacom applications

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PCB Footprints
BMR4912510/871 - Flex Power Modules PCB footprint - Other - Other - BMR491X510/871-2
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3D Models
BMR4912510/871 - Flex Power Modules  - 3D model - Other - BMR491X510/871-2
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BMR4912510/871 Details

  • Manufacturer Part Number:

    BMR4912510/871

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    1/4 BRICK PACKAGE-15/14

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Flex Ltd

  • YTEOL:

    8

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    C-UL-US, EN, IEC, UL

  • Efficiency (Main Output):

    97.1%

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    40 V

  • Input Voltage-Nom:

    54 V

  • JESD-30 Code:

    R-XDMA-P14

  • Length:

    58.4 mm

  • Line Regulation-Max:

    0.0625%

  • Load Regulation-Max:

    0.0416%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    95 °C

  • Operating Temperature-Min:

    -30 °C

  • Output Current-Max:

    55 A

  • Output Voltage-Max:

    26.4 V

  • Output Voltage-Min:

    16 V

  • Output Voltage-Nom:

    24 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,14/15LEAD,2.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Protections:

    OVER CURRENT; OVER VOLTAGE; OVER TEMPERATURE; SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.03535 Vrms

  • Screening Level:

    EN/IEC/UL 62368-1

  • Seated Height-Max:

    14.5 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    DUAL

  • Total Power Output-Max:

    1300 W

  • Trim/Adjustable Output:

    YES

  • Warm-up Time:

    0.08 s

  • Width:

    36.8 mm

BMR4912510/871 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the BMR4912510/871 involve using a multi-layer PCB with a solid ground plane, placing the component on a thermal pad, and ensuring good airflow around the device. A thermal via array under the component can also help to dissipate heat.
  • To ensure reliability and longevity in high-temperature applications, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and implement a robust cooling system. Additionally, consider using a thermally conductive adhesive and a heat sink to dissipate heat efficiently.
  • The recommended soldering conditions for the BMR4912510/871 include using a soldering iron with a temperature range of 220°C to 250°C, a soldering time of 3-5 seconds, and a peak temperature of 260°C. For rework, use a hot air rework station with a temperature range of 180°C to 220°C and a airflow rate of 10-20 L/min.
  • To troubleshoot common issues, start by verifying the PCB layout and thermal management, checking for proper component placement and soldering, and ensuring that the input voltage and current are within the recommended range. Use oscilloscopes and thermal imaging cameras to identify the root cause of the issue and make adjustments accordingly.
  • Yes, to minimize EMI/EMC issues, ensure that the PCB layout follows good EMI/EMC design practices, such as using a solid ground plane, placing decoupling capacitors close to the device, and using shielded cables for input and output connections. Additionally, consider using EMI filters or common-mode chokes to reduce electromagnetic interference.

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BMR4912510/871 Overview

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