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BPS110-AD01P0-2DG - Bourns

Description: Board Mount Pressure Sensor 0psi to 1psi Differential 8-Pin SMD Module T/R

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BPS110-AD01P0-2DG - Bourns PCB footprint - Other - Other - BPS110-AD01P0-2DG-1
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BPS110-AD01P0-2DG - Bourns  - 3D model - Other - BPS110-AD01P0-2DG-1
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BPS110-AD01P0-2DG Details

  • Manufacturer Part Number:

    BPS110-AD01P0-2DG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-8

  • Country Of Origin:

    USA

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2019-04-18

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Accuracy-Max (%):

    0.25%

  • Additional Feature:

    PORT DIAMETER 2.2 MM

  • Body Breadth:

    10.2 mm

  • Body Length or Diameter:

    12.7 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Bits:

    12

  • Operating Current-Max:

    2.4 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    0.50-4.50V

  • Output Type:

    ANALOG VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Port Type:

    STRAIGHT

  • Pressure Sensing Mode:

    DIFFERENTIAL

  • Sensors/Transducers Type:

    PRESSURE SENSOR, MEMS, PIEZORESISTIVE

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

BPS110-AD01P0-2DG Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and to prevent overheating.
  • The current sense resistor value depends on the maximum current, desired voltage drop, and power dissipation. Bourns provides a current sense resistor selection guide in their application note AN165, which can help engineers choose the correct value for their specific application.
  • Although the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to consider the derating curves for power dissipation and temperature. Bourns recommends consulting their application notes and thermal management guidelines to ensure the device operates within a safe temperature range.
  • While the BPS110-AD01P0-2DG is a robust device, it's crucial to consider the mechanical stress and vibration tolerance. Bourns recommends following their guidelines for mechanical stress and vibration testing, as outlined in their application note AN166, to ensure the device can withstand the environmental conditions.
  • To ensure EMC, it's essential to follow proper PCB design and layout practices, such as using a solid ground plane, minimizing loop areas, and using shielding if necessary. Bourns provides EMC design guidelines in their application note AN167, which can help engineers minimize electromagnetic interference.

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