BPS110-AG0P15-2DG footprint, schematic symbol and 3D model by Bourns

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PCB Footprints

BPS110-AG0P15-2DG - Bourns PCB footprint - Other - Other - BPS110-AG0P15-2DG-1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for BPS110-AG0P15-2DG
Part Number BPS110-AG0P15-2DG
Manufacturer Bourns
Pin Count 8
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - BPS110-AG0P15-2DG-1
Released Date Feb 7, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

BPS110-AG0P15-2DG Details

Manufacturer Part Number:
BPS110-AG0P15-2DG
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
PACKAGE-8
Country Of Origin:
USA
Factory Lead Time:
24 Weeks
Date Of Intro:
2019-04-18
Manufacturer:
Bourns Inc
YTEOL:
8
Accuracy-Max (%):
0.25%
Additional Feature:
PORT DIAMETER 2.2 MM
Body Breadth:
10.2 mm
Body Length or Diameter:
12.7 mm
Mounting Feature:
SURFACE MOUNT
Number of Bits:
12
Operating Current-Max:
2.4 mA
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Range:
0.50-4.50V
Output Type:
ANALOG VOLTAGE
Package Shape/Style:
RECTANGULAR
Port Type:
STRAIGHT
Pressure Sensing Mode:
GAUGE
Sensors/Transducers Type:
PRESSURE SENSOR, MEMS, PIEZORESISTIVE
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
2.7 V
Surface Mount:
YES
Termination Type:
SOLDER

BPS110-AG0P15-2DG Frequently Asked Questions (FAQs)

A symmetrical layout with a solid ground plane and short, direct traces to the device's pins is recommended. This helps to minimize electromagnetic interference (EMI) and ensures optimal performance.
While the device is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments.
Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure a reliable connection. Avoid excessive soldering temperatures and times to prevent damage to the device.
Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or leads to prevent electrostatic discharge (ESD) damage.
While the device is designed to withstand some vibration and shock, it's essential to consider the specific environmental requirements and ensure the device is properly secured to the PCB and the PCB is securely fastened to the system.

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BPS110-AG0P15-2DG Overview

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