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BR24H32FJ-5ACE2 - ROHM Semiconductor

Description: 125 °C Operation I 2C BUS EEPROM for Automotive (2-Wire)

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BR24H32FJ-5ACE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-J8
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BR24H32FJ-5ACE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-J8
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BR24H32FJ-5ACE2 Details

  • Manufacturer Part Number:

    BR24H32FJ-5ACE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-J8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2020-07-17

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    1 MHz

  • Data Retention Time-Min:

    50

  • Endurance:

    4000000 Write/Erase Cycles

  • I2C Control Byte:

    1010DDDR

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    32768 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    2.5 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.65 mm

  • Serial Bus Type:

    I2C

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    3.5 ms

  • Write Protection:

    HARDWARE

BR24H32FJ-5ACE2 Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note AP16115, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The BR24H32FJ-5ACE2 has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a heat sink can be used to further improve heat dissipation. ROHM recommends a thermal resistance of ≤10°C/W.
  • Although the datasheet doesn't specify a maximum operating frequency, ROHM recommends an operating frequency of up to 100 MHz for this device. However, the actual frequency limit may depend on the specific application and PCB design.
  • The BR24H32FJ-5ACE2 is rated for operation up to 125°C, but ROHM recommends derating the device's performance at high temperatures. Consult ROHM's application notes and thermal management guidelines for more information.
  • The POR function requires a proper power-up sequence and a stable power supply. Ensure that the power supply voltage rises monotonically and reaches the minimum operating voltage (VDD) before the device is enabled. A 10 kΩ pull-up resistor on the reset pin can also help ensure a clean reset signal.

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