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BR25H080F-2CE2 - ROHM Semiconductor

Description: 8KBit, SPI BUS, Serial EEPROM for Automotive (125℃ Operation)

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BR25H080F-2CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP8 (1)
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3D Models
BR25H080F-2CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP8 (1)
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BR25H080F-2CE2 Details

  • Manufacturer Part Number:

    BR25H080F-2CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED

  • Clock Frequency-Max (fCLK):

    10 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Memory Density:

    8192 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.71 mm

  • Serial Bus Type:

    SPI

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    HARDWARE/SOFTWARE

BR25H080F-2CE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 125°C) and consider derating the device's power dissipation accordingly. Additionally, ensure proper thermal management and consider using a heat sink if necessary.
  • ROHM recommends soldering conditions of 260°C peak temperature, 10s to 30s soldering time, and a soldering iron temperature of 350°C to 370°C. It's also essential to follow the recommended soldering profile to prevent damage to the component.
  • To prevent ESD damage, handle the component in an ESD-protected environment, use ESD-protected tools and equipment, and follow proper grounding procedures. It's also recommended to use ESD-protective packaging and storage materials.
  • ROHM recommends storing the component in a dry, cool place (temperature range: 5°C to 30°C, humidity: 60% or less) away from direct sunlight and moisture. It's also essential to follow the recommended storage and handling procedures to prevent damage.

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