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BRCF016GWZ-3E2 - ROHM Semiconductor

Description: WL-CSP EEPROM

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PCB Footprints
BRCF016GWZ-3E2 - ROHM Semiconductor PCB footprint - BGA - BGA - UCSP30L1
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3D Models
BRCF016GWZ-3E2 - ROHM Semiconductor  - 3D model - BGA - UCSP30L1
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BRCF016GWZ-3E2 Details

  • Manufacturer Part Number:

    BRCF016GWZ-3E2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    1 MHz

  • JESD-30 Code:

    R-PBGA-B4

  • Length:

    0.86 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Seated Height-Max:

    0.35 mm

  • Serial Bus Type:

    I2C

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.84 mm

  • Write Cycle Time-Max (tWC):

    5 ms

BRCF016GWZ-3E2 Frequently Asked Questions (FAQs)

  • ROHM recommends following the recommended PCB layout guidelines in the application note AN11984, which includes using a solid ground plane, minimizing trace lengths, and using a 4-layer PCB with a dedicated power plane.
  • To ensure the device operates within the specified temperature range, make sure to provide adequate heat dissipation, use a heat sink if necessary, and avoid exposing the device to extreme temperatures during storage or operation.
  • ROHM recommends using a 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric, rated for at least 6.3V, as close to the VIN pin as possible to ensure stable operation.
  • While the BRCF016GWZ-3E2 is designed to be robust, it's still important to follow proper mounting and soldering techniques to ensure reliability in high-vibration environments. Consider using a vibration-resistant mounting method, such as a screw-down or adhesive-mounted package.
  • Check the input voltage, ensure the enable pin is properly biased, verify the output capacitor value and type, and check for any signs of overheating or physical damage. Consult the datasheet and application notes for more detailed troubleshooting guidance.

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