BSB165N15NZ3GXUMA1 - Infineon

BSB165N15NZ3GXUMA1 Details

• Manufacturer Part Number:

  BSB165N15NZ3GXUMA1

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  GREEN, METAL, WDSON-2, CANPAK-3

• Pin Count:

  3

• Reach Compliance Code:

  Compliant

• ECCN Code:

  EAR99

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  0

• Avalanche Energy Rating (Eas):

  440 mJ

• Case Connection:

  DRAIN

• Configuration:

  SINGLE WITH BUILT-IN DIODE

• DS Breakdown Voltage-Min:

  150 V

• Drain Current-Max (ID):

  9 A

• Drain-source On Resistance-Max:

  0.0165 Ω

• FET Technology:

  METAL-OXIDE SEMICONDUCTOR

• JESD-30 Code:

  R-MBCC-N3

• JESD-609 Code:

  e4

• Moisture Sensitivity Level:

  3

• Number of Elements:

  1

• Number of Terminals:

  3

• Operating Mode:

  ENHANCEMENT MODE

• Operating Temperature-Max:

  150 °C

• Package Body Material:

  METAL

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER

• Polarity/Channel Type:

  N-CHANNEL

• Power Dissipation-Max (Abs):

  78 W

• Pulsed Drain Current-Max (IDM):

  180 A

• Qualification Status:

  Not Qualified

• Surface Mount:

  YES

• Terminal Finish:

  Silver/Nickel (Ag/Ni)

• Terminal Form:

  NO LEAD

• Terminal Position:

  BOTTOM

• Transistor Application:

  SWITCHING

• Transistor Element Material:

  SILICON