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BSC005N03LS5ATMA1 - Infineon

Description: MOSFET TRENCH <= 40V

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BSC005N03LS5ATMA1 - Infineon PCB footprint - Other - Other - PG-TDSON-8-62
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BSC005N03LS5ATMA1 - Infineon  - 3D model - Other - PG-TDSON-8-62
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BSC005N03LS5ATMA1 Details

  • Manufacturer Part Number:

    BSC005N03LS5ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Austria, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    900 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    433 A

  • Drain-source On Resistance-Max:

    0.00095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    300 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    188 W

  • Pulsed Drain Current-Max (IDM):

    1731 A

  • Reference Standard:

    IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC005N03LS5ATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BSC005N03LS5ATMA1 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet, and ensure the device is operated within the recommended operating conditions.
  • For optimal thermal performance, use a multi-layer PCB with a thermal via under the device, and ensure good thermal conductivity between the device and the heat sink. Follow the recommended PCB layout guidelines in the datasheet.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. The device has built-in ESD protection, but additional external protection may be necessary depending on the application.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device with care to prevent mechanical damage, and follow proper ESD handling procedures.

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