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BSC019N04LSATMA1 - Infineon

Description: N-Channel 40 V 27A (Ta), 100A (Tc) 2.5W (Ta), 78W (Tc) Surface Mount PG-TDSON-8-1

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BSC019N04LSATMA1 - Infineon PCB footprint - Other - Other - BSC019N04LSATMA1-1
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BSC019N04LSATMA1 - Infineon  - 3D model - Other - BSC019N04LSATMA1-1
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BSC019N04LSATMA1 Details

  • Manufacturer Part Number:

    BSC019N04LSATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    90 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    136 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    78 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Reference Standard:

    IEC-61249-2-21; IEC-68-1

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSC019N04LSATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for BSC019N04LSATMA1 is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet, and ensure the device is operated within the recommended operating conditions.
  • For optimal thermal performance, use a multi-layer PCB with a thermal via structure, and ensure good thermal conductivity between the device and the heat sink. Refer to the application note for specific layout recommendations.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure the device is stored in an ESD-protected environment. The device also has built-in ESD protection, but it's still important to follow proper handling procedures.
  • The BSC019N04LSATMA1 is manufactured according to Infineon's quality and reliability standards, which include ISO/TS 16949 and AEC-Q101. The device is also qualified according to the automotive industry's stringent reliability standards.

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